3D Integration of ultra-thin functional devices inside standard multilayer flex laminates

Nowadays, more and more wearable electronic systems are being realized on flexible substrates. Main limiting factor for the mechanical flexibility of those wearable systems are typically the rigid components - especially the relatively large active components - mounted on top and bottom of the flex substrates. Integration of these active devices inside the flex multilayers will not only enable for a high degree of miniaturization but can also improve the total flexibility of the system. This paper now presents a technology for the 3D embedding of ultra-thin active components inside standard flex laminates. Active components are first thinned down to 20-25 mu m, and packaged as an Ultra-Thin Chip Pack-age (UTCP). These UTCP packages will serve as flexible interposer: all layers are so thin, that the whole package is even bendable. The limited total pack-age thickness of only 60 mu m makes them also suitable for lamination in between commercial flex panels, replacing for example the direct die integration. A fan-out metallization on the package facilitates easy testing before integration, solving the KGD issue, and can also relax the chip contact pitch, excluding the need for very precise placement and the use of expensive, fine-pitch flex substrates. The technology is successfully demonstrated for the 3D-integration of a Texas Instrument MSP430 low-power microcontroller, inside the conventional double sided flex laminate of a wireless ECG system. The microcontrollers are first thinned down and UTCP pack-aged These pack-ages are then laminated in between the large panels of the flex multilayer stack and finally connected to the different layers of the flex board by metallized through-hole interconnects. The thinning down, the UTCP pack-aging and the 3D-integration inside the commercial flex panels did not have any affect on the functionality of the TI microcontroller. Smaller SMD's were finally mounted on top and bottom of the integrated device

Multiple chip integration for flat flexible electronics

These days, there is a lot of interest for making electronic devices lighter and compacter, as the electronics market is rapidly expanding with all sorts of portable devices for home and everyday use. Here, a technology for embedding single thin chips in flexible substrates is further investigated so that several chips might be integrated within the same substrate. This technology offers the possibility of reducing weight, while at the same time enhancing the mechanical flexibility of the electronic circuitry. Such an integration is particularly interesting in the area of flexible displays, where the flexibility of the display is too often hampered by the rigidity of its driving electronics

Embedding of optical interconnections in flexible electronics

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Thermo-mechanical analysis of flexible and stretchable systems

This paper presents a summary of the modeling and technology developed for flexible and stretchable electronics. The integration of ultra thin dies at package level, with thickness in the range of 20 to 30 μ m, into flexible and/or stretchable materials are demonstrated as well as the design and reliability test of stretchable metal interconnections at board level are analyzed by both experiments and finite element modeling. These technologies can achieve mechanically bendable and stretchable subsystems. The base substrate used for the fabrication of flexible circuits is a uniform polyimide layer, while silicones materials are preferred for the stretchable circuits. The method developed for chip embedding and interconnections is named Ultra Thin Chip Package (UTCP). Extensions of this technology can be achieved by stacking and embedding thin dies in polyimide, providing large benefits in electrical performance and still allowing some mechanical flexibility. These flexible circuits can be converted into stretchable circuits by replacing the relatively rigid polyimide by a soft and elastic silicone material. We have shown through finite element modeling and experimental validation that an appropriate thermo mechanical design is necessary to achieve mechanically reliable circuits and thermally optimized packages

Embedding and assembly of ultrathin chips in multilayer flex boards

Dieser Beitrag ist mit Zustimmung des Rechteinhabers aufgrund einer (DFG geförderten) Allianz- bzw. Nationallizenz frei zugänglich.This publication is with permission of the rights owner freely accessible due to an Alliance licence and a national licence (funded by the DFG, German Research Foundation) respectively.Purpose – The purpose of this paper is to present results from the EC funded project SHIFT (Smart High Integration Flex Technologies) on the embedding in and the assembly on flex substrates of ultrathin chips. Design/methodology/approach – Methods to embed chips in flex include flip-chip assembly and subsequent lamination, or the construction of a separate ultra-thin chip package (UTCP) using spin-on polyimides and thin-film metallisation technology. Thinning and separation of the chips is done using a “dicing-by-thinning” method. Findings – The feasibility of both chip embedding methods has been demonstrated, as well as that of the chip thinning method. Lamination of four layers of flex with ultrathin chips could be achieved without chip breakage. The UTCP technology results in a 60 mm package where also the 20mm thick chip is bendable. Research limitations/implications – Further development work includes reliability testing, embedding of the UTCP in conventional flex, and construction of functional demonstrators using the developed technologies. Originality/value – Thinning down silicon chips to thicknesses of 25mm and lower is an innovative technology, as well as assembly and embedding of these chips in flexible substrates.EC/FP6/EU/507745/Smart high-integration flex technologies/SHIF

Un nuevo esquema conceptual para la interpretación de las mezclas impropias en mecánica cuántica

En este artículo, analizamos el significado de las matrices densidad en el formalismo de la mecánica cuántica. Discutimos el problema de los "sistemas cuánticos compuestos" en la lógica cuántica así como también la interpretación de las mezclas impropias. Tomando en cuenta el desarrollo de la lógica cuántica convexa, presentamos un análisis de la estructura formal de la teoría que, argumentaremos, debe ser considerado a la hora de desarrollar un nuevo esquema conceptual para la interpretación de las mezclas cuánticas.In this article, we analyze the meaning of density matrices within the formalism of quantum mechanics. We discuss the problem of compound systems in the context of quantum logic as well as the interpretation of improper mixtures. Taking into account the development of convex quantum logic, we present an analysis of the formal structure of the theory which we will argue, must be taken into account when developing a new conceptual scheme for the interpretation of quantum mixtures

Optical interconnections embedded in flexible substrates

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